IGF – Investigation of the influence of thermally conductive fillers on flame retardant substrate materials [FLA-HEAT]
Duration: 11/01/2021 – 10/31/2023
Research objective
Investigation of the influencing factors of thermally conductive fillers and their orientation on the flame retardant properties at different states of conditioning
- Development of compounds combining thermal conductivity and improved flame retardancy
- Knowledge of the essential influencing factors of the process-structure-property relationships as well as their interaction during injection moulding with regard to flame behaviour
- Findings on the influence of thermally conductive fillers on ignition and flame propagation
- Transfer of the developed compounds to the LDS process for the production of MID-structurable circuit carriers
- Low-cost, highly conductive elastomers for printed, flexible electronics
Figure: Microscopic image of a laser-direct structured and metallized copper (Cu) / nickel (Ni) / gold (Au) conductor track on polyethylene terephthalate (PET) / polybutylene terephthalate (PBT) blend with details of the thermal expansion coefficients α of the individual layers; Source: Wang, L., Zhang, L., Fischer, A., Zhong, Y., Drummer, D., Wu, W.: Enhanced thermal conductivity and flame retardancy of polyamide 6/flame retardant composites with hexagonal boron nitride. Journal of Polymer Engineering 38 (2018), S. 767–774.
Expected use of the envisaged research results in SMEs
- Use of the developed ink formulation in flexible electronics
- Development of new innovative product ideas through extended possibilities
- Winning new orders through better competitive position due to cheaper and more reliable inks
