2017 Trade Fairs

The research association 3-D MID e.V. presented itself in recent years at various important trade fairs. For instance at the productronica from 1999 to 2009 and the SMT hybrid packaging from 2011 to 2015. Various trade fair activities are planned for the year 2017 as well.

Messeauftritt 3-D MID e.V. SMT 2015

Pictutre: Joint Stand 3-D MID e.V. at the SMT 2015

 

The leading trade fair for printed electronics - LOPEC - took place in Munich in March 2017. The research association held a booth there from the 29th to the 30th. March 2017 

More information can be found here.

In June, the research association exhibited for the first time at the International Fair for Additive Technologies - Rapid.Tech from the 20th to the 22nd of June 2017 in Hall 2 (Stand 2-602a) in Erfurt.

More inforfmation here.


The highlight of the trade fair year is the large stand of the Research Association Molded Interconnect Devices - 3-D MID e.V. at the productronica in Munich. From November 14th to November 17th 2017 the Research Association will be organising a joint stand with our members.

    Contact:

     

    Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
    Fuerther Straße 246b
    D-90429 Nuremberg
    Phone: +49 911 5302-9100
    Fax: +49 911 5302-9102
    E-Mail: Info@3dmid.de