NEWS IN BRIEF

  • 13th MID Congress: 

    world's largest event on MID technology from 25th to 27th September 2018 in Würzburg.

    Further information

The Research Association 3-D MID e.V. again at LOPEC 2018 

From 14th to 15th March 2018, the international trade fair for printed electronics - LOPEC - which was very well attended with 2,500 participants from 51 countries in its tenth year, again showed the latest trends and developments in research and production of printed electronics. Many end users inter alia from the fields of wearables, automobiles and consumer electronics, learned about the latest trends at the trade fair and conference.

A strong increase in exhibitors and, once again, in trade fair space reflects the growth in the sector of printed electronics, which continues to grow in 2018 as well. In addition to new materials and equipment for printed electronics, exhibitors also showed numerous prototypes and commercial products with printed electronic components. This year, the central theme and example of a future market with high potential was the topic "wellbeing". Both applications in the medical and pharmaceutical technology as well as the sports industry, in particular printed sensors, were in focus.

At the LOPEC congress held in parallel, the current trends in printed electronics were presented in 188 technical contributions by international technology experts. Here, the topic MID was represented with its own session and members of the 3-D MID e.V. demonstrated the potential of MID technology in the context of printed electronics. 

Numerous other members of the 3-D MID e.V. showed their own state-of-the-art technologies and developments. The following were represented: Bauhaus University Weimar Interface Design Group, Fraunhofer IAP, Fraunhofer IFAM, Fraunhofer IZM, Henkel AG & Co. KGaA, IPC - Innovation Plasturgie Composites, Merck KGaA, Neo-tech AMT GmbH and ZAE Bayern.

 

   

LOPEC is the leading trade fair for printed electronics - MID members Henkel and Merck are also present with a booth (© Messe München)

 

The Research Association Molded Interconnect Devices 3-D MID e.V. also informed with its own booth again. In numerous intensive discussions, it was possible to raise awareness of the potential of MID technology in the context of printed electronics. Transported through various exhibits, MID technology posters and monitor presentations on current research topics, the interest of a large number of visitors was aroused and a large number of discussions initiated. In view of the possibilities of integrating sensors, antennas and OLEDs into almost freely configurable, three-dimensional circuit carriers with a wide variety of substrate materials, such as plastic, glass, ceramics, paper and metal, numerous connection points between MID technology and printed electronics can be identified. In addition, this emphasizes the expanded understanding of MID as Mechatronic Integrated Devices.

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