19. April 2021 Project Outline: Digital printing of solution-based encapsulation of organic electronics on 3D surfaces [SolEnc] Read more
16. April 2021 Project Outline: Measurement of the adhesive strength of printed conductive layers in electronics production [Adhesion4PE] Read more
14. April 2021 Project Outline: Inductive inline sintering for electrical printed conductive structures with a process control system [INSEL] Read more
12. April 2021 Project Outline: Flexible interconnections on three-dimensional components [FHVEB] Read more
12. April 2021 Project outline: power density electromagnetic actuators by winding body of Al2O3-insulated aluminium foils (E|Aloxid) Read more
12. April 2021 Project Outline: High-performance deposition of copper layers on three-dimensional circuit carriers (HAKa3D) Read more
11. April 2021 Project Outline: Additive manufacturing of dielectric elastomers for industrial use (AMDEA) Read more