Description
Silver sintered on 3D ceramic substrates for electronics in high temperature applications
Duration: 06/01/2018 – 05/31/2020
Objective: Use of ceramic substrate in conjunction with silver interconnect technology to extend the application to higher temperatures and harsh environments.
Research institutes and contact persons
For further contact details, please contact the office. E-Mail to office
Hochschule Aschaffenburg HAB – FIW
Christian Schwarzer
Wuerzburger Straße 45
63743 Aschaffenburg, GER
Friedrich-Alexander University Erlangen-Nuremberg
Institute for Factory Automation and Production Systems (FAPS)
Alexander Hensel
Fuerther Straße 246b
90429 Nuremberg, GER
Documents
Documentation on the project is available in the members’ area or on request from the office at info@3dmid.de. E-Mail to office
If you are not a member yet, you will find information about membership here.
Summary of the final publication (freely accessible to all)
