IGF-Project 21780 N - 3D-MLD - Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.

IGF – 3D multilayer printing from Mechatronic Integrated Devices [3D-MLD]

Duration: 04/01/2021 – 03/31/2023

Research objectives

In the research project applied for, the generative printing of multilayer conductor tracks with vias on spatial free-form surfaces is being researched in order to increase the integration density of 3D mechatronic integrated devices (3D-MID). The approach pursued is based on a printing process in which an alternating coating of the component surface, with metal-containing paints for conductor tracks and dielectric layers for insulation, is combined with laser processing. In addition to the photothermal laser sintering of conductor track paths, the ablative laser processing of the dielectric layers also enables electrical vias in the multilayer structure. The new process technology should achieve the following goals: Great variety of possible substrate materials, as the layering process can be used regardless of the substrate material used. High variability of the products (number of items 1) through laser processing and avoidance of storage (lot size 1) through the investigation of the process on additively manufactured (3D printing) components. Substitution of components and circuit board substrates through the direct production of electronic functional elements (e.g. coils, capacitors) and highly integrated contacting of fine pitch ball grid array (BGA) chips directly on the component surface.