1. July 2022 Introduction of the Research Project “Laser Direct Structured Circuits on Silicone” Read more 13. June 2022 Progress Report of the project “PrESens” – Additive Manufacturing for the Integration of Sensor Technology in Mechatronic Systems Read more 24. May 2022 Introduction of the project outline: Characterization of laser powder cladding for fast, flexible and direct generation of conductive structures on three-dimensional ceramic substrates [CeraClad] Read more 18. May 2022 Progress report of the project DigiTIMe [Digital printing of conductive inks by inkjet for miniaturization of electronic assemblies] Read more 2. May 2022 Introduction of the project outline: Development planner for the design and production of hybrid circuit carriers [Pre-Designer] Read more Prev 1 2 3 4 … 11 Next
1. July 2022 Introduction of the Research Project “Laser Direct Structured Circuits on Silicone” Read more
13. June 2022 Progress Report of the project “PrESens” – Additive Manufacturing for the Integration of Sensor Technology in Mechatronic Systems Read more
24. May 2022 Introduction of the project outline: Characterization of laser powder cladding for fast, flexible and direct generation of conductive structures on three-dimensional ceramic substrates [CeraClad] Read more
18. May 2022 Progress report of the project DigiTIMe [Digital printing of conductive inks by inkjet for miniaturization of electronic assemblies] Read more
2. May 2022 Introduction of the project outline: Development planner for the design and production of hybrid circuit carriers [Pre-Designer] Read more